30 Pin ZIF FPC Connector 1.0mm Pitch Height 2.1mm F10011FA030M1WLJ9

The F10011FA030M1WLJ9 is a high-performance, 30-pin Zero Insertion Force (ZIF) connector designed for Flexible Printed Circuits (FPC). This surface-mount component features a 1.0mm pitch and a low-profile vertical height of 2.1mm, providing a reliable and space-efficient interconnection for high-density electronic assemblies.

Pitch	1.0mm
Number of Pins	30
Total Height	2.10mm
Body Width	8.0mm

F10011FA030M1WLJ9

Product Overview

This connector is part of the “Wide Version” series, which utilizes an 8.0mm body width to ensure superior mechanical stability on the PCB. It is engineered with a front-flip (actuator) locking mechanism and a bottom-contact design. To maintain signal integrity and enhance mechanical retention, the assembly is equipped with integrated grounding functionality.

Product Specifications

Pitch: 1.0 mm.
Height: 2.1 mm.
Body Width: 8.0 mm (Wide Version).
Number of Positions: 30 Pins.
Housing Material: High-temperature White LCP (Series standard).
Actuator Material: Black LCP (Series standard).
Terminal Material: Phosphor Copper (Series standard).
Grounding Clips: Copper Alloy (Series standard).
Contact Area Plating: Gold plating (1u” Min) over Nickel underplate.
Solder Area Plating: Matte Tin (80~160u”).

Product Features

ZIF Flip-Lock Design: The front-flip actuator allows for zero-force insertion of the FPC, protecting the delicate conductive gold fingers from mechanical wear.
Integrated Shielding: Features grounding functionality to provide a secure electrical path for EMI reduction and increase the mechanical strength of the solder joints.
Robust Wide Footprint: The 8.0mm width provides a larger footprint, ensuring maximum stability on the PCB during operation and vibration.
Thermal Reliability: Constructed with LCP thermoplastic materials, making the connector fully compatible with standard lead-free reflow soldering processes.
Superior Connectivity: Selective gold plating in the contact area ensures low contact resistance and long-term environmental durability.

Applications

Based on its 30-pin configuration and grounded design, this connector is typically used in:

Display Modules: Connecting LCD or OLED panels to main control boards.
Consumer Electronics: Internal signal routing for laptops, tablets, and handheld devices.
Automotive Systems: Infotainment displays and digital dashboard clusters.
Industrial Equipment: Compact monitoring and high-density diagnostic tools.

Packing Details

Packaging Type: Vacuum Packaging.
Protection: The vacuum seal protects the gold-plated terminals and LCP housing from environmental moisture and oxidation during transit and storage.

FAQ (Frequently Asked Questions)

1. Does the F10011FA030M1WLJ9 support grounding for EMI management?

Yes, this model is designed with grounding functionality and includes integrated metal clips to secure the FPC and provide a grounding path.

2. Which direction should the FPC conductive traces face?

This connector utilizes a bottom-contact design, meaning the conductive gold fingers of the FPC must face downward toward the PCB surface during insertion.

3. What is the benefit of the Wide Version width for a 30-pin connector?

The 8.0mm wide footprint offers a larger surface area for better adhesion and structural stability on the PCB compared to narrower variants, which is ideal for applications subject to vibration.