ZIF FPC Connector 24 Pin 0.5mm Pitch 2.1mm Height High-performance F05057FA024M1WLJ9

The ZIF FPC Connector F05057FA024M1WLJ9 is a high-reliability surface-mount interconnection solution designed for high-density electronic assemblies. This 24-pin component features a standard 0.50mm pitch and a low-profile 2.1mm height, providing a stable and secure interface for Flexible Printed Circuits (FPC) in demanding environments.

Pitch	0.5mm
Number of Pins	24
Body Width	6.0mm
Total Height	2.10mm

F05057FA024M1WLJ9

Product Overview

Part of the “Wide Version” series, this model is distinguished by its robust 8.0mm body width, which offers enhanced mechanical stability on the PCB compared to narrower variants. It utilizes a front-flip (actuator) locking mechanism and a bottom-contact design. To ensure superior signal integrity and mechanical retention, the assembly is equipped with integrated left and right grounding clips.

Product Specifications

Pitch: 0.50 mm.
Height: 2.1 mm.
Body Width: 8.0 mm (Wide Version).
Number of Positions: 24 Pins.
Housing Material: White LCP (Liquid Crystal Polymer).
Actuator Material: Black LCP.
Terminal Material: Phosphor Copper.
Grounding Clips: Copper Alloy (Left and Right).
Plating: Contact area Gold (1u” Min); Solder area Matte Tin (80~160u”); Nickel base (50~100u”).

Product Features

Zero Insertion Force (ZIF): Facilitates effortless FPC insertion, protecting delicate conductive “gold fingers” from mechanical wear during assembly.
Integrated Shielding: Features grounding functionality through metal clips on both sides to provide a secure electrical path for EMI reduction and increase mechanical solder strength.
Secure Flip-Lock Design: The front-flip actuator ensures a reliable mechanical connection and easy operation for assembly technicians.
Thermal Durability: Constructed with high-performance LCP thermoplastic materials, making it fully compatible with standard lead-free high-temperature reflow soldering processes.
Robust Wide Footprint: The 8.0mm width ensures maximum adhesion and structural reliability on the PCB.

Applications

Given its 24-pin configuration and robust grounded design, this connector is typically used in:

Display Interfaces: Connecting LCD or OLED panels to main control boards in tablets and laptops.
Automotive Systems: Reliable signal routing for digital instrument clusters and infotainment modules.
Consumer Electronics: Internal high-density connections for premium smartphones and handheld devices.
Industrial/Medical: Compact diagnostic imaging and high-density monitoring equipment.

Packing Details

Packaging Type: Vacuum Packaging.
Purpose: The vacuum seal protects the gold-plated terminals and LCP housing from environmental moisture and oxidation during transit and storage.

FAQ (Frequently Asked Questions)

1. Does the F05057FA024M1WLJ9 support grounding for EMI protection? Yes, this model is designed “with grounding functionality” and includes integrated left and right copper alloy clips to provide a secure grounding path.

2. Which direction should the FPC conductive gold fingers face? This is a bottom-contact design, meaning the conductive traces of the FPC must face downward toward the PCB surface during insertion.

3. Is this connector compatible with lead-free reflow soldering? Yes, the housing and actuator are made of LCP (Liquid Crystal Polymer), a high-temperature material specifically chosen to withstand the temperatures required for standard lead-free SMT reflow processes.