High-Performance SFP+ 1×4 Cage With Heat Sink S2N3400550NA4

Product Overview

The S2N3400550NA4 is an SFP+ 1×4 cage assembly from Vitalconn, designed to support four SFP+ modules in a single row configuration. It incorporates a heat sink to effectively dissipate heat from the modules, ensuring stable operation in high-performance networking environments. The product utilizes press fit pins for secure and reliable connection to the PCB, eliminating the need for soldering.

Product Specifications

Based on the available database and similar product documentation:
· Product Type: SFP+ 1×4 Cage with Heat Sink
· Part Number: S2N3400550NA4
· Termination Type: Press Fit
· Port Configuration: 1×4 (4 ports in a single row)
· Material: Copper Alloy, Thickness 0.25mm, Ni-Plated
· RoHS Compliant: Yes

Product Features

· Integrated heat sink for enhanced thermal management
· Press fit termination for reliable, solderless PCB mounting
· 1×4 port configuration for space-efficient design
· RoHS compliant for environmental safety
· Robust copper alloy construction for durability
· Designed for high-speed SFP+ applications ensuring signal integrity

Applications

· High-speed networking switches and routers
· Data center equipment
· Telecommunications infrastructure
· Server and storage systems
· Fiber optic transceiver modules requiring thermal management

Packing Details

Based on similar SFP+ 1×4 cage products from Vitalconn:
· Product Quantity per Box: 128 PCS
· Trays per Box: 8 PCS
· Box Size: L340 x W265 x H200 mm
· Labels per Box: 2 PCS
· Packaging Tapes: 8 M (approx.)

FAQ

1. What is the termination type of the S2N3400550NA4?
The S2N3400550NA4 features press fit termination, which allows for reliable PCB mounting without the need for soldering.

2. Does this product include a heat sink?
Yes, the S2N3400550NA4 is an SFP+ 1×4 cage with an integrated heat sink designed to improve thermal management for high-speed modules.

3. How many ports does the S2N3400550NA4 support?
This product supports 4 ports in a 1×4 configuration, making it suitable for applications requiring multiple SFP+ modules in a compact layout.