8 Pin ZIF FPC Connector 1.0mm Pitch Height 2.1mm F10041FA008M1WL-DJ9

Product Overview

This connector is categorized as a “Narrow Version”, featuring a compact body width of 6.0mm to save board space. It utilizes a front-flip (actuator) locking mechanism and a bottom-contact design. To ensure signal integrity and mechanical stability, the assembly is equipped with integrated grounding functionality.

Product Specifications

• Pitch: 1.0 mm.
• Height: 2.1 mm.
• Body Width: 6.0 mm (Narrow Version).
• Number of Positions: 8 Pins.
• Housing Material: White LCP (Liquid Crystal Polymer).
• Actuator Material: Black LCP.
• Terminal Material: Phosphor Copper.
• Contact Area Plating: Gold plating (1u” Min) over a Nickel underplate (50~100u”).
• Solder Area Plating: Matte Tin (80~160u”).

Product Features

• ZIF Flip-Lock Design: The front-flip actuator allows for zero-force insertion of the FPC, protecting delicate conductive gold fingers from mechanical damage during assembly.
• Integrated Shielding: Features grounding functionality to provide a secure electrical path for EMI reduction and increase mechanical solder strength.
• Narrow Profile: The 6.0mm width allows for high-density placement in space-constrained layouts compared to standard wide versions.
• Thermal Durability: Constructed with high-performance LCP thermoplastic, making it fully compatible with standard lead-free reflow soldering processes.
• Reliable Connectivity: Selective gold plating in the contact area ensures low contact resistance and long-term durability against oxidation.

Applications

Based on its 8-pin configuration and compact profile, this connector is suitable for:

• Small Displays: Connecting compact LCD or OLED panels to main control boards.
• Consumer Electronics: Internal cabling for wearables, smartphones, and handheld gadgets.
• Sensors and Modules: Interfacing cameras, touch sensors, and compact signal modules.
• Automotive/Industrial: High-density connections in digital clusters or monitoring equipment.

Packing Details

• Packaging Type: Vacuum Packaging.
• Protection: The vacuum seal protects the gold-plated terminals and LCP housing from environmental moisture and oxidation during transit and storage.

FAQ (Frequently Asked Questions)

1. Does this connector support grounding for signal integrity?

Yes, this model is designed with grounding functionality and includes integrated metal clips to secure the FPC and provide a grounding path.

2. What is the contact orientation for the F10041FA008M1WL-DJ9?

This model utilizes a bottom-contact design, meaning the conductive traces of the FPC must face downward toward the PCB for a successful connection.

3. Is this connector compatible with SMT automated assembly?

Yes, it is a surface-mount component designed for SMT assembly and is constructed from LCP material to withstand reflow soldering temperatures.